Admissions

Innovative Technology Designs Start with the Right PCB

The R&D work of the DEEE is facilitated by a state of the art printed circuit board (PCB) fabrication laboratory. It is a facility dedicated to the design and fabrication of printed circuit boards. It is equipped with a variety of software and hardware resources, including CAD software, 3D printers, and milling machines. The laboratory is used by students and faculty in the electrical and electronic engineering department to design and prototype new electronic devices.

The laboratory is also equipped to handle not only standard FR-4 based PCBs but advance PCBs such as multi-layer boards up to 8 layers, RF and microwave board requiring high precision, and flexible PCBs. The key fabrication techniques used include precision CNC milling and photolithography. The laboratory is also equipped with a pick and place machine, soldering stations for hand soldering, and a re-flow over with programmable temperature profiling.

PCB
 
 

EQUIPMENT AND EXPERIMENTAL SETUPS  

 

Below, you will find pictures of laboratory setups, equipment, etc., belonging to the PCB Fabrication laboratory.

CNC MILLING MACHINE and PHOTO-LITHOGRAPHY
PCB Milling Machine Photo-Plotter Multi-layer Press PCB Laminating Machine
PCB Milling Machine PCB Plotter Multi-layer Press PCB Laminating
UV Exposure Unit Spray Developer/Etcher Cupric Chloride Bubble Etcher Gold, Copper, Tin Platting Bath
PCB UV Exposure PCB Etcher

 

    
 
CIRCUIT ASSEMBLY AND SOLDERING
LPKF Pick and Place Machine Reflow Oven
Pick and Place

This machine is semi-automatic and is capable of placing surface mount components which require high accuracy such as 0.25 mm pitch ICs and ball-grid array ICs.

 Reflow Oven

LPKF ProtoFlow-S. This machine is temperature profile programmable and is used for soldering and other curing processes that require accurate temperature profiling.
Soldering de-soldering Stations  
Soldering

The laboratory is equipped with both find tip solder stations and hot-air stations for both SMT and through-hole type soldering/de-soldering.

 

  

 
 
FABRICATION AND ELECTROPLATTING
LPKF Pro-Conduct through hole Fabrication Unit Copper Electroplating
Through-hole Fabrication

 

This is based on an hole-wall activator solution and traditional copper electroplating.