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Department of Electrical and Electronic Engineering
University of Peradeniya
pdn-logo
Department of Electrical and Electronic Engineering
University of Peradeniya

Circuit Assembly and Soldering

LPKF Pick and place machine

This machine is semi-automatic and is capable of placing surface mount components which require high accuracy such as 0.25 mm pitch ICs and ball-grid array ICs.

Reflow Oven

LPKF ProtoFlow-S. This machine is temperature profile programmable and is used for soldering and other curing processes that require accurate temperature profiling.

Soldering/De-soldering stations

The laboratory is equipped with both find tip solder stations and hot-air stations for both SMT and through-hole type soldering/de-soldering.

Professional Organizition

PHES IEEE IESL IET

Where we are

Copyright 2015 - Department of Electrical & Electronic Engineering